Late in cycle — a new model is likely coming soon
Best for: Serious makers and prosumers who need enclosed printing for ABS, ASA, PA, PA-CF, and PC — and want Bambu's plug-and-play experience at a prosumer price.
Full details →Mid-cycle — watch for announcements before buying
Best for: Professional makers, small studios, and engineers who need dual-material printing — particularly for PVA soluble supports, dual-color engineering parts, or high-throughput production.
Full details →| Bambu Lab P2S | Bambu Lab H2S | |
|---|---|---|
| Tier | Prosumer | Professional |
| Motion | CoreXY | CoreXY |
| Build Volume | 256 × 256 × 256 mm | 350 × 320 × 325 mm |
| Max Speed | 500 mm/s | 600 mm/s |
| Multicolor | ✅ 4 slots | ✅ 2 slots |
| Enclosure | ✅ | ✅ |
| Auto Calibration | ✅ | ✅ |
| Open Source | ❌ | ❌ |
| Upgrade Kit | — | — |
| Materials | PLA, PETG, ABS, ASA, TPU, PA, PA-CF, PC | PLA, PETG, ABS, ASA, TPU, PA, PA-CF, PC, PETG-CF |
| Released | Jun 15, 2025 | Jun 15, 2025 |
| Cycle length | ~270 days | ~270 days |
| Cycle advice | Wait | Caution |
| Deals advice | Buy | Caution |
| Next model | P3S or next prosumer model (Expected mid-2026) | H2C (Expected late 2026) |
The P2S enclosure maintains a more consistent chamber temperature over the P1S, reducing warping on long ABS and PA prints.
PLA through PC — the P2S handles the entire engineering filament spectrum with reliable results.
The P-series CoreXY enclosure design strikes the best balance of price, speed, and material capability in Bambu's lineup.
The H2S adds better high-speed cooling and more consistent layer adhesion at 600 mm/s, addressing key H2D pain points.
Dual-nozzle printing eliminates the purge tower required by filament-switching systems — faster prints, less wasted filament.
Print PLA + PVA or ABS + HIPS combinations for complex geometries that would be impossible with a single material.